Honor Magic 2 With Sliding Camera, FullView Display, Kirin 980 SoC, 40W Magic Charge Support Teased at IFA 2018

Honor Magic 2 With Sliding Camera, FullView Display, Kirin 980 SoC, 40W Magic Charge Support Teased at IFA 2018

Honor showed up at IFA 2018with a surprise this year – Magic 2

HIGHLIGHTS

  • Honor Magic 2 to come with a ‘Magic Slide’ camera
  • The smartphone will be powered by a Kirin 980 SoC
  • Magic 2 also comes with the 40W Magic Charger

Honor is jumping on the sliding camera bandwagon with its Magic 2 smartphone. During its event at IFA 2018 in Berlin, the Huawei sub-brand teased a smartphone called Honor Magic 2 that is claimed to come with a bezel-free display by leveraging a sliding camera functionality. The handset is a successor to the Honor Magic that was launched back in 2016 with display curves and AI-based features. The Magic 2, meanwhile, comes with a ‘Magic Slide’ feature that enables the phone to have a nearly 100 percent screen-to-body ratio.

At the IFA trade show, Honor only showed the Magic 2 briefly onstage. The successor to Magic phone did not get a proper announcement, but Honor President George Zhao teased some of the key features. However, the company did not provide too much information regarding the price, specifications, and availability of the smartphone. A zoomed-in image from Honor’s event shared by GSMArena, showcases the interesting-looking device that lacks any bezels or notches.

The most interesting feature in the Honor Magic 2 is its FullView display. There are no display notches or any significant chin at the bottom. It resembles the Oppo Find X that was launched earlier this year. Xiaomi has also recently teased a Mi Mix 3 with an “all-screen” display that moves the frontal paraphernalia to the slider behind the screen. Interestingly, as per the images, unlike the Find X, the Honor Magic 2’s camera slider appears to open manually. However, it may also be due to it being just an engineering sample and not a final product.

Additionally, the Honor Magic 2 will be powered by a Kirin 980 processor. At the same event, Huawei had launched the HiSilicon Kirin 980 as the ‘world’s first commercial 7nm SoC’. Compared to the previous generation 10nm process, the 7nm process is said to deliver 20 percent improved SoC performance and 40 percent more efficiency. Also, the Honor Magic 2 will come with a 40W ‘Magic Charge’ fastcharging technology. It is claimed to be very fast and safe. Honor, in a press release, said, “to further ensure safety, 15 layers of protection are also embedded in the smartphone. The phone can automatically identify the battery, cable and charger and only when all of the three parts are identified as safe, the Super Charger will start.”

“The launch of Honor Magic two years ago introduced the concept of the AI smartphone to consumers”, noted Zhao. “The first-generation Honor Magic was an era-defining smartphone that transformed the industry. In addition to AI-features that make the phone truly smart, Honor Magic’s ground-breaking all-curved panel design and powerful 40W charging support have reshaped smartphone design and become a benchmark for all smartphones. The developments of these futuristic flagship devices are closely followed by the smartphone and AI industry, and now the Honor Magic 2 has arrived.”

[“Source-gadgets.ndtv”]

Samsung Exynos 9 Series 9810 SoC Launched, Based on 10nm FinFET Process

Samsung Exynos 9 Series 9810 SoC Launched, Based on 10nm FinFET Process

HIGHLIGHTS

  • Samsung unveils the Exynos 9 Series 9810 SoC
  • It is likely to debut on the company’s Galaxy S9
  • The chipset can be expected to feature on phones next year

Samsung has announced a new flagship mobile processor in the Exynos 9 series, built on the 10nm process. As is traditional with such unveils, it can be expected that the new new Exynos 9 Series 9810 SoC will be the processor powering the company’s next flagship smartphone, the Galaxy S9.

The Samsung Exynos 9810 packs the company’s third-generation custom CPU cores and also comes with an upgraded GPU. Samsung is also touting support for Gigabit LTE modem which can offer what Samsung calls industry’s first 6CA (carrier aggregation) support. Samsung says that the new Exynos 9 Series 9810 SoC has been built on second-generation 10nm process technology.

The Exynos 9 Series is said to be the company’s first processor chipset built on the 10-nanometre FinFET process technology.

The South Korean company earlier this year unveiled its premium application processor, the Exynos 9 Series 8895. Some of the highlights of the Exynos 9 Series 8895 processor were embedding of a Gigabit LTE modem that can support five carrier aggregation, or 5CA. It supports LTE Cat. 16 with download speeds of up to 1Gbps and upload speeds of up to 150Mbps (Cat. 13). The chipset was used in the Samsung Galaxy S8 and Galaxy S8+ as well as the company’s Galaxy Note 8 phablet.

Rumours have pointed to early next year launch of the Qualcomm Snapdragon 845 SoC which could be seen as the competitor to the Exynos 9 Series 9810 SoC. The Snapdragon 845 SoC is said to be built on a new faster, more efficient 7nm fabrication process. Furthermore, the new Qualcomm SoC is also said to debut on the Galaxy S9 next year.

For Samsung’s upcoming flagships, the company is widely expected to retain Infinity Displays which allow the 5.8-inch and 6.2-inch screens to come with a relatively compact factor. The upcoming Galaxy S9 and Galaxy S9+ smartphones are rumoured to use the same screen sizes as well as the same curved design first seen on the Galaxy S8 and Galaxy S8+.

[“Source-gadgets.ndtv”]

LG G6 Will Use Snapdragon 821 SoC to Get Advantage Over Samsung Galaxy S8: Report

LG G6 Will Use Snapdragon 821 SoC to Get Advantage Over Samsung Galaxy S8: Report
HIGHLIGHTS
LG G6 is expected to sport Snapdragon 821 SoC
Thanks to Snapdragon 821 SoC, the G6 to get head start over Galaxy S8
LG G6 expected to be unveiled at the company’s February 26 event
LG’s next flagship smartphone, the G6, has been rumoured for few weeks now to sport the Snapdragon 821 processor instead of the latest Snapdragon 835. A new report has corroborated to the earlier leak and adds that this will mean that the LG G6 will have a head start compared to the Galaxy S8 availability in the market.

SemiAccurate has shared a screenshot of presentation showcased during a limited media event by LG at the CES 2017. The leaked presentation screenshot indeed confirms the presence of Qualcomm Snapdragon 821 processor in the LG G6. Some of the other details tipped by the leaked screenshot include a water and dust resistant body, a rear fingerprint scanner, and a 5.7-inch QHD display. The leaked screenshot clearly shows the “LG confidential” tagline on top of the presentation slide.

The new report also throws light on the fact that LG’s G6 flagship will be getting a comprehensive headstart when compared to the Samsung Galaxy S8. It adds that if LG had gone with the Snapdragon 835 SoC instead, it wouldn’t be able to release the G6 before late-May or early-June. The report also reiterates Qualcomm’s new Snapdragon 835 SoC is built on the 10nm FinFET fabrication process by Samsung and this means that the South Korean company may use major share of the SoC for itself.
SemiAccurate claims that LG’s flagship will see the launch event in late February while the “volume launch worldwide in March sometime” which will give the G6 a good gap of at least over a month when compared to Samsung’s Galaxy S8. According to previous leaks, the Galaxy S8 is rumoured to go on sale in South Korea first only by late April.

Several leaks have pointed that the LG G6 will sport metal design which will be a departure from the company’s current plastic body in the LG G5, which sports a modular design. LG is also rumoured to run additional safety tests on the G6 ahead of its actual launch. Some of the highlights of the handset are said to be the first non-Pixel smartphone to come preloaded with Google Assistant out-of-the-box; dual-rear camera setup, and waterproofing capability with IP68 certification.

LG’s G6 flagship smartphone will be unveiled at the company’s February 26 event which will begin at 4.30pm IST (12.00pm CET).

Tags: MWC, MWC 2017, LG, LG Mobiles, LG G6, LG G6 Specifications

[“source-smallbiztrends”]

New rumor suggests Snapdragon 835 SoC and 6GB RAM for LG V30

While the upcoming LG G6 might miss on the Snapdragon 835 SoC (thanks to Samsung), the successor to LG’s V20 smartphone may well be powered by that chipset. The information comes courtesy of a new rumor out of China.

As for availability, the rumor reveals H2 2017 time-frame. No details related to pricing were revealed. Earlier rumors had suggested the V30 won’t have a secondary display – it’s being said that the ticker will be replaced with something even better.

[“source-smallbiztrends”]

In addition, the rumor suggests that the V30 will have 6GB RAM, feature a dual camera setup on both back as well as front, and will come with a better DAC compared to the V20. It also says the phone will have “more mysterious features,” although no details were provided on them.